S.E.Display Co., Ltd.

FPC Auto Bonder

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S.E.Display Co., Ltd.
[Korea]

Address
Room 701-705, 7 Floor, Kumkang Hi-Tech Valley, 133, Sangdaewon-dong, Jungwon-gu, Sungnam-si, Gyeonggi-do
Phone
82-31-7775777
Contact name
Tae-jun Park

Quick Information

  • Model Number : CFAB-100

Description

It enable to perform pre-bonding and main-bonding(3head) process at correct location through PCB auto-supplying & auto alignment after bonding ACF on Film (FPCB) and then accomplish move the end-product out with full automatic function

Specification

item
specifications
Application capability
FPC, Film & PCB, GLASS
PCB size (mm)
2.5 (L) x 1.5 (W) ~ 105 (L) x 105 (W)
FPC (Film) size (mm)
10 (L) x 5 (W) x 0.1 (t) ~ 70 (L) x 60 (W) x 1.5 (t)
Tact time
9 sec/ FPC (Include LD,ULD time)
Bonding accuracy
±10㎛
Bonding pressure
0.1~15.0kgf (0.1kgf step)
Heater temp range
Pre-Bonding unit : Room ~ 100°C,
Main-Bonding unit : Room ~ 400°C
Vision system unit
4 CCD Camera (2 Pixel display)
Power Supply
3Φ, AC 220V, 210A, 46Kw
Physical Dimension
5500(L) x 1200(W) x 1700(H) mm


Product Image

  • FPC Auto Bonder image

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