S.E.Display Co., Ltd.

Die Bonder for Camera Module

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S.E.Display Co., Ltd.
[Korea]

Address
Room 701-705, 7 Floor, Kumkang Hi-Tech Valley, 133, Sangdaewon-dong, Jungwon-gu, Sungnam-si, Gyeonggi-do
Phone
82-31-7775777
Contact name
Tae-jun Park

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Product Details

Quick Information

  • Model Number : CDB-100

Description

It enable to perform PCB (FPCB) & Die (Sensor) bonder adopted with auto vision alignment & bonding

Specification

item
specifications
Tact Time
5.0 Sec/EA
(Loading & Un-Loading)
Bonding Accuracy
± 10㎛
Bonding Head
1 (Pre & Main)
Temperature Rang
Accuracy
0°C~300°C
±3°C
Power Supply
1Φ, AC 220V, 40A, 8.8Kw
Dimensions
1400(L) x 1200(W) x 1700(H)


Product Image

  • Die Bonder for Camera Module image

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