COG Auto Bonder

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S.E.Display Co., Ltd.
[Korea]

Address: Room 701-705, 7 Floor, Kumkang Hi-Tech Valley, 133, Sangdaewon-dong, Jungwon-gu, Sungnam-si, Gyeonggi-do

Product Details

Quick Information

This fully automated COG bonder apply to produce below3" product. The fastest cycle time is 4.5sec/panel

Specification

item	specifications
Application capability	COG
Chip size(mm)	6mm(L)X1.2mm(W) ~ 28mm(L)X5mm(W) T = 0.3mm ~ 1.0mm
Glass size(Iinch)	1.0" ~ 4.0"
Chip feeding method	Tray (2 inch, 4 inch)
Cycle time	4.5sec / panel
Bonding accuracy	±5㎛
Bonding pressure	0.1~30.0kgf (0.1kgf step)
Heater temp range	Pre-Bonding unit : Room ~ 100°C, Main-Bonding unit : Room ~ 300°C
Vision system unit	4 CCD Camera (2 Pixel display)
Option unit	Dispenser
Power Supply	3Φ, AC 220V, 110A, 24Kw
Physical Dimension	2800(L) x 1600(W) x 1700(H) mm
Option	1. Auto Loader/Un-loader * 20Trays(30Panels / 1 Tray) * Dimensions: 800(L) x 1600(W) x 1700(H)mm each 2. Simple Loader/Un-loader * Manual loaded by operator

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