COF/COG Multi-Use Auto Bonder
- Company Name:S.E.Display Co., Ltd.
- Membership:Free Member
- Member Since:2007. 01.16
- Country/Region:Korea
- City:Gyeonggi-do
- Contact:Tae-jun Park
- Related Keywords:COF/COG Multi-Use Auto Bonder, Machinery
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S.E.Display Co., Ltd.
[Korea]
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Specification
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item
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specifications
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Application capability
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COG, COF, FPCB, TCP(Unit Type)
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Chip size(mm)
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2.5 (L) x 1.5 (W) ~ 30 (L) x 5.0 (W)
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Film or Glass size(mm)
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10 (L) x 5 (W) x 0.1 (t) ~ 170 (L) x 140 (W) x 1.5 (t)
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Chip feeding method
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Tray (2 inch, 4 inch)
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Tact time
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6.5 sec/film (Include LD,ULD time)
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Bonding accuracy
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±5㎛
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Bonding pressure
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0.1~15.0kgf (0.1kgf step)
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Heater temp range
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Pre-Bonding unit : Room ~ 100°C,
Main-Bonding unit : Room ~ 300°C |
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Vision system unit
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4 CCD Camera (2 Pixel display)
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Power Supply
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3Φ, AC 220V, 210A, 46.2Kw
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Physical Dimension
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5500(L) x 1200(W) x 1700(H) mm
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